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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Features
CAS Latency and Frequency
CAS Latency 3 Maximum Operating Frequency (MHz) DDR400 (5T) 200
* * * * * * * * * * * * *
* DDR 512M bit, Die C, based on 90nm design rules * Double data rate architecture: two data transfers per clock cycle * Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver * DQS is edge-aligned with data for reads and is centeraligned with data for writes
Differential clock inputs (CK and CK) Four internal banks for concurrent operation Data mask (DM) for write data DLL aligns DQ and DQS transitions with CK transitions Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS Burst lengths: 2, 4, or 8 CAS Latency: 3 Auto Precharge option for each burst access Auto Refresh and Self Refresh Modes 7.8s Maximum Average Periodic Refresh Interval 2.5V (SSTL_2 compatible) I/O VDD = VDDQ = 2.6V 0.1V RoHS compliance
Description
Die C of 512Mb SDRAM devices based using DDR interface. They are all based on Nanya's 90 nm design process. The 512Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. It is internally configured as a quad-bank DRAM. The DDR SDRAM provides for programmable Read or Write burst lengths of 2, 4, or 8 locations. An Auto Precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access.
As with standard SDRAMs, the pipelined, multibank architecture of DDR SDRAMs allows for concurrent operation, The 512Mb DDR SDRAM uses a double-data-rate architecthereby providing high effective bandwidth by hiding row preture to achieve high-speed operation. The double data rate .com activation time. charge and DataShee architecture is essentially a 2n prefetch architecture with an interface designed to transfer two data words per clock cycle An auto refresh mode is provided along with a power-saving at the I/O pins. A single read or write access for the 512Mb Power Down mode. All inputs are compatible with the JEDEC DDR SDRAM effectively consists of a single 2n-bit wide, one Standard for SSTL_2. All outputs are SSTL_2, Class II comclock cycle data transfer at the internal DRAM core and two patible. corresponding n-bit wide, one-half-clock-cycle data transfers The functionality described and the timing specifications at the I/O pins. included in this data sheet are for the DLL Enabled mode of A bidirectional data strobe (DQS) is transmitted externally, operation. along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR SDRAM during Reads and by the memory controller during Writes. DQS is edgealigned with data for Reads and center-aligned with data for Writes. The 512Mb DDR SDRAM operates from a differential clock (CK and CK; the crossing of CK going high and CK going LOW is referred to as the positive edge of CK). Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK. Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed. The address bits registered coincident with the Read or Write command are used to select the bank and the starting column location for the burst access.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Ordering Information (Green)
Speed Org. 128M x 4 Part Number NT5DS128M4CG-5T Package Clock (MHz) 60-Ball BGA 200 CL-tRCD-tRP 3-3-3 DDR400 Comments
Note: 1. At the present time, there are no plans to support DDR SDRAMs with the QFC function. All reference to QFC are for information only
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Pin Configuration - 60Ball BGA(x4)
128 X 4 1 VSSQ NC NC NC NC VREF 2 NC VDDQ VSSQ VDDQ VSSQ VSS CLK A12 A11 A8 A6 A4 3 VSS DQ3 NC DQ2 DQS DM CLK CKE A9 A7 A5 VSS A B C D E F G H J K L M 7 VDD DQ0 NC DQ1 NC NC WE RAS BA1 A0 A2 VDD 8 NC VSSQ VDDQ VSSQ VDDQ VDD CAS CS BA0 A10/AP A1 A3 9 VDDQ NC NC NC NC NC
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Input/Output Functional Description
Symbol CK, CK Type Input Function Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK (both directions of crossing). Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power Down and Self Refresh operation (all banks idle), or Active Power Down (row Active in any bank). CKE is synchronous for power down entry and exit, and for self refresh entry. CKE is asynchronous for self refresh exit. CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK and CKE are disabled during Power Down. Input buffers, excluding CKE, are disabled during self refresh. The standard pinout includes one CKE pin. Optional pinouts might include CKE1 on a different pin, in addition to CKE0, to facilitate independent power down control of stacked devices. Chip Select: All commands are masked when CS is registered high. CS provides for external bank selection on systems with multiple banks. CS is considered part of the command code. The standard pinout includes one CS pin. Command Inputs: RAS, CAS and WE (along with CS) define the command being entered. Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled high coincident with that input data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. During a Read, DM can be driven high, low, or floated. Bank Address Inputs: BA0 and BA1 define to which bank an Active, Read, Write or Precharge command is being applied. BA0 and BA1 also determines if the mode register or extended mode register is to be accessed during a MRS or EMRS cycle. Address Inputs: Provide the row address for Active commands, and the column address and Auto Precharge bit for Read/Write commands, to select one location out of the memory array in .com the respective bank. A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 low) or all banks (A10 high). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also provide the op-code during a Mode Register Set command. Data Input/Output: Data bus. Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture write data. No Connect: No internal electrical connection is present. Not Useable:Electrical connection is present. Should not be connected at second level of assembly. DQ Power Supply: 2.5V 0.1V DQ Ground Power Supply: 2.5V 0.1V Ground SSTL_2 reference voltage: (VDDQ / 2) 1%.
CKE, CKE0, CKE1
Input
CS RAS, CAS, WE
Input Input
DM
Input
BA0, BA1
Input
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A0 - A12 Input
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DQ DQS NC NU VDDQ VSSQ VDD VSS VREF
Input/Output Input/Output Supply Supply Supply Supply Supply
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Block Diagram (128Mb x 4)
Control Logic
CKE CK CK CS WE CAS RAS
Command Decode
Bank1 Row-Address MUX Bank0 Row-Address Latch & Decoder
Bank2
Bank3 CK, CK DLL
Mode Registers
13
8192
Read Latch
Refresh Counter 13
4 4 MUX 4 DQS Generator 1
Sense Amplifiers Bank Control Logic
16384
8
Drivers
15
13
Bank0 Memory Array (8192 x 2048 x 8)
Data
Address Register
COL0 I/O Gating DM Mask Logic 2048 (x8) Column Decoder 11 8 8 Write FIFO & Drivers
2
2 8
4
4 4
4 clk clk out in Data CK, CK COL0
4
12
Column-Address Counter/Latch 1
COL0
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1
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Receivers
A0-A12, BA0, BA1
2
15
Input Register 1 Mask 1 1 1 1
DQS
DQ0-DQ3, DM DQS
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Note: This Functional Block Diagram is intended to facilitate user understanding of the operation of the device; it does not represent an actual circuit implementation. Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the bidirectional DQ and DQS signals.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Functional Description
The 512Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. The 512Mb DDR SDRAM is internally configured as a quad-bank DRAM. The 512Mb DDR SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 512Mb DDR SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.
Initialization
Only one of the following two conditions must be met. * No power sequencing is specified during power up or power down given the following criteria: VDD and VDDQ are driven from a single power converter output VTT meets the specification A minimum resistance of 42 ohms limits the input current from the VTT supply into any pin and .com t4U.com VREF tracks VDDQ /2 or * The following relationships must be followed: VDDQ is driven after or with VDD such that VDDQ < VDD + 0.3V VTT is driven after or with VDDQ such that VTT < VDDQ + 0.3V VREF is driven after or with VDDQ such that VREF < VDDQ + 0.3V The DQ and DQS outputs are in the High-Z state, where they remain until driven in normal operation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SDRAM requires a 200s delay prior to applying an executable command. Once the 200s delay has been satisfied, a Deselect or NOP command should be applied, and CKE must be brought HIGH. Following the NOP command, a Precharge ALL command must be applied. Next a Mode Register Set command must be issued for the Extended Mode Register, to enable the DLL, then a Mode Register Set command must be issued for the Mode Register, to reset the DLL, and to program the operating parameters. 200 clock cycles are required between the DLL reset and any read command. A Precharge ALL command should be applied, placing the device in the "all banks idle" state Once in the idle state, two auto refresh cycles must be performed. Additionally, a Mode Register Set command for the Mode Register, with the reset DLL bit deactivated (i.e. to program operating parameters without resetting the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation. DDR SDRAM's may be reinitialized at any time during normal operation by asserting a valid MRS command to either the base or extended mode registers without affecting the contents of the memory array. The contents of either the mode register or extended mode register can be modified at any valid time during device operation without affecting the state of the internal address refresh counters used for device refresh.
DataShee
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Register Definition
Mode Register The Mode Register is used to define the specific mode of operation of the DDR SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, and an operating mode. The Mode Register is programmed via the Mode Register Set command (with BA0 = 0 and BA1 = 0) and retains the stored information until it is programmed again or the device loses power (except for bit A8, which is self-clearing). Mode Register bits A0-A2 specify the burst length, A3 specifies the type of burst (sequential or interleaved), A4-A6 specify the CAS latency, and A7-A12 specify the operating mode. The Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements results in unspecified operation.
Burst Length
Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable. The burst length determines the maximum number of column locations that can be accessed for a given Read or Write command. Burst lengths of 2, 4, or 8 locations are available for both the sequential and the interleaved burst types. Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2-Ai when the burst length is set to four and by A3-Ai when the burst length is set to eight (where Ai is the most significant column address bit for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. The programmed burst length .com t4U.com applies to both Read and Write bursts. DataShee
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Mode Register Operation
BA1 0* BA0 0* A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 BT A2 A1 A0 Address Bus Mode Register
Operating Mode
CAS Latency
Burst Length
A12 - A9 0 0 0
A8 0 1 0
A7 0 0 1
A6 - A0 Valid Valid VS**
Operating Mode Normal operation Do not reset DLL Normal operation in DLL Reset Vendor-Specific Test Mode Reserved A3 0 1 Burst Type Sequential Interleave
-
-
-
CAS Latency
A6 0 0 0 0 1 1 1 1 A5 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 Latency Reserved Reserved Reserved 3 Reserved Reserved Reserved Reserved A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1
Burst Length
A0 0 1 0 1 0 1 0 1 Burst Length Reserved 2 4 8 Reserved Reserved Reserved Reserved
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VS** Vendor Specific * BA0 and BA1 must be 0, 0 to select the Mode Register (vs. the Extended Mode Register).
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Burst Definition
Starting Column Address Burst Length A2 2 0 0 4 1 1 0 0 0 0 8 1 1 1 1 0 0 1 1 0 0 1 1 A1 A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Type = Sequential 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Type = Interleaved 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 Order of Accesses Within a Burst
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Notes:
1. For a burst length of two, A1-A i selects the two-data-element block; A0 selects the first access within the block. 2. For a burst length of four, A2-A i selects the four-data-element block; A0-A1 selects the first access within the block. 3. For a burst length of eight, A3-A i selects the eight-data- element block; A0-A2 selects the first access within the block. 4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Burst Definition on page 9. Read Latency The Read latency, or CAS latency, is the delay, in clock cycles, between the registration of a Read command and the availability of the first burst of output data. The latency can be programmed 3 clocks for DDR400. If a Read command is registered at clock edge n, and the latency is m clocks, the data is available nominally coincident with clock edge n + m. Reserved states should not be used as unknown operation or incompatibility with future versions may result.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Operating Mode
The normal operating mode is selected by issuing a Mode Register Set Command with bits A7-A12 to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a Mode Register Set command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the desired values. A Mode Register Set command issued to reset the DLL should always be followed by a Mode Register Set command to select normal operating mode. All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test modes and reserved states should not be used as unknown operation or incompatibility with future versions may result.
CAS Latencies
CAS CK CK Command Read NOP CL=3 DQS DQ NOP NOP
Latency = 3, BL = 4
NOP
NOP
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Shown with nominalAC , tDQSCK , and tDQSQ. t
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Don't Care
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Extended Mode Register
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, bit A0; output drive strength selection, bit A1; and QFC output enable/disable, bit A2 (NTC optional). These functions are controlled via the bit settings shown in the Extended Mode Register Definition. The Extended Mode Register is programmed via the Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the stored information until it is programmed again or the device loses power. The Extended Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating any subsequent operation. Violating either of these requirements result in unspecified operation.
DLL Enable/Disable
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is automatically disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any time the DLL is enabled, 200 clock cycles must occur to allow time for the internal clock to lock to the externally applied clock before a Read command can be issued. This is the reason for introducing timing parameter tXSRD for DDR SDRAM's (Exit Self Refresh to Read Command). Non- Read commands can be issued 2 clocks after the DLL is enabled via the EMRS command (tMRD) or 10 clocks after the DLL is enabled via self refresh exit command (tXSNR, Exit Self Refresh to Non-Read Command).
Output Drive Strength
The normal drive strength for all outputs is specified to be SSTL_2, Class II.
QFC Enable/Disable (Not support in this product; Only for information)
.com t4U.com The QFC signal is an optional DRAM output control used to isolate module loads (DIMMs) from the system memory bus by
ee means of external FET switches when the given module (DIMM) is not being accessed. The QFC function is an optional feature DataSh for NANYA and is not included on all DDR SDRAM devices.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Extended Mode Register Definition
BA1 0* BA0 1* A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 QFC A1 DS A0 DLL Address Bus Extended Mode Register
Operating Mode
Drive Strength
A12 - A3 0 A2 - A0 Valid Operating Mode Normal Operation All other states Reserved 0 1 Normal Reserved A1 Drive Strength
-
-
A2 0 1
QFC Disable Enable (Not Support) A0 0 DLL Enable Disable
* BA0 and BA1 must be 1, 0 to select the Extended Mode Register (vs. the base Mode Register)
1
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Commands
Truth Tables 1a and 1b provide a reference of the commands supported by DDR SDRAM devices. A verbal description of each commands follows.
Truth Table 1a: Commands
Name (Function) Deselect (Nop) No Operation (Nop) Active (Select Bank And Activate Row) Read (Select Bank And Column, And Start Read Burst) Write (Select Bank And Column, And Start Write Burst) Burst Terminate Precharge (Deactivate Row In Bank Or Banks) Auto Refresh Or Self Refresh (Enter Self Refresh Mode) Mode Register Set CS H L L L L L L L L RAS X H L H H H L L L CAS X H H L L H H L L WE X H H H L L L H L Address X X Bank/Row Bank/Col Bank/Col X Code X Op-Code MNE NOP NOP ACT Read Write BST PRE AR / SR MRS Notes 1, 9 1, 9 1, 3 1, 4 1, 4 1, 8 1, 5 1, 6, 7 1, 2
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1. CKE is high for all commands shown except Self Refresh. 2. BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register; BA0 = 1, BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode Register.) 3. BA0-BA1 provide bank address and A0-A12 provide row address. 4. BA0, BA1 provide bank address; A0-Ai provide column address (where i = 9 for x8 and 9, 11 for x4); A10 high enables the Auto Pre.com charge feature (non-persistent), A10 low disables the Auto Precharge feature. 5. A10 LOW: BA0, BA1 determine which bank is precharged. A10 HIGH: all banks are precharged and BA0, BA1 are "Don't Care." 6. This command is auto refresh if CKE is high; Self Refresh if CKE is low. 7. Internal refresh counter controls row and bank addressing; all inputs and I/Os are "Don't Care" except for CKE. 8. Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should not be used) for read bursts with Auto Precharge enabled or for write bursts 9. Deselect and NOP are functionally interchangeable.
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Truth Table 1b: DM Operation
Name (Function) Write Enable Write Inhibit 1. Used to mask write data; provided coincident with the corresponding data. DM L H DQs Valid X Notes 1 1
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Deselect The Deselect function prevents new commands from being executed by the DDR SDRAM. The DDR SDRAM is effectively deselected. Operations already in progress are not affected. No Operation (NOP)
The No Operation (NOP) command is used to perform a NOP to a DDR SDRAM. This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected.
Mode Register Set
The mode registers are loaded via inputs A0-A12, BA0 and BA1 while issuing the Mode Register Set Command. See mode register descriptions in the Register Definition section. The Mode Register Set command can only be issued when all banks are idle and no bursts are in progress. A subsequent executable command cannot be issued until tMRD is met.
Active
The Active command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A12 selects the row. This row remains active (or open) for accesses until a Precharge (or Read or Write with Auto Precharge) is issued to that bank. A Precharge (or Read or Write with Auto Precharge) command must be issued and completed before opening a different row in the same bank.
Read
The Read command is used to initiate a burst read access to an active (open) row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9, j = don't care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being accessed is precharged at the end of the Read burst; if Auto Precharge is not selected, the row remains .com t4U.com open for subsequent accesses. DataShee
Write
The Write command is used to initiate a burst write access to an active (open) row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9, j = don't care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being accessed is precharged at the end of the Write burst; if Auto Precharge is not selected, the row remains open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DM input logic level appearing coincident with the data. If a given DM signal is registered low, the corresponding data is written to memory; if the DM signal is registered high, the corresponding data inputs are ignored, and a Write is not executed to that byte/column location.
Precharge
The Precharge command is used to deactivate (close) the open row in a particular bank or the open row(s) in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the Precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as "Don't Care." Once a bank has been precharged, it is in the idle state and must be activated prior to any Read or Write commands being issued to that bank. A precharge command is treated as a NOP if there is no open row in that bank, or if the previously open row is already in the process of precharging.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Auto Precharge
Auto Precharge is a feature which performs the same individual-bank precharge function described above, but without requiring an explicit command. This is accomplished by using A10 to enable Auto Precharge in conjunction with a specific Read or Write command. A precharge of the bank/row that is addressed with the Read or Write command is automatically performed upon completion of the Read or Write burst. Auto Precharge is non-persistent in that it is either enabled or disabled for each individual Read or Write command. Auto Precharge ensures that the precharge is initiated at the earliest valid stage within a burst. This is determined as if an explicit Precharge command was issued at the earliest possible time without violating tRAS(min). The user must not issue another command to the same bank until the precharge (tRP) is completed. The NTC DDR SDRAM devices supports the optional tRAS lockout feature. This feature allows a Read command with Auto Precharge to be issued to a bank that has been activated (opened) but has not yet satisfied the tRAS(min) specification. The tRAS lockout feature essentially delays the onset of the auto precharge operation until two conditions occur. One, the entire burst length of data has been successfully prefetched from the memory array; and two, tRAS(min) has been satisfied. As a means to specify whether a DDR SDRAM device supports the tRAS lockout feature, a new parameter has been defined, tRAP (RAS Command to Read Command with Auto Precharge or better stated Bank Activate to Read Command with Auto Precharge). For devices that support the tRAS lockout feature, tRAP = tRCD(min). This allows any Read Command (with or without Auto Precharge) to be issued to an open bank once tRCD(min) is satisfied.
tRAP Definition
CL=2, tCK=10ns CK CK Command
NOP ACT NOP RD A NOP NOP DQ0 NOP DQ1 NOP ACT NOP NOP
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DQ (BL=2)
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tRASmin
DataShee
tRPmin
NOP DQ3 ACT NOP NOP
Command DQ (BL=4)
NOP
ACT
NOP
RD A
NOP
NOP DQ0
*
DQ1
NOP DQ2
Command DQ (BL=8)
NOP
ACT
NOP
RD A
NOP
NOP DQ0
*
DQ1
tRPmin
NOP DQ3 DQ4 NOP DQ5 DQ6 ACT DQ7 NOP
NOP DQ2
tRCDmin tRAPmin
The above timing diagrams show the effects of tRAP for devices that support tRAS lockout. In these cases, the Read with Auto Precharge command (RDA) is issued with tRCD(min) and dataout is available with the shortest latency from the Bank Activate command (ACT). The internal precharge operation, however, does not begin until after tRAS(min) is satisfied.
*
*
tRPmin
Indicates Auto Precharge begins here
Burst Terminate
The Burst Terminate command is used to truncate read bursts (with Auto Precharge disabled). The most re-cently registered Read command prior to the Burst Terminate command is truncated, as shown in the Operation section of this data sheet. Write burst cycles are not to be terminated with the Burst Terminate command.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Auto Refresh
Auto Refresh is used during normal operation of the DDR SDRAM and is analogous to CAS Before RAS (CBR) Refresh in previous DRAM types. This command is nonpersistent, so it must be issued each time a refresh is required. The refresh addressing is generated by the internal refresh controller. This makes the address bits "Don't Care" during an Auto Refresh command. The 512Mb DDR SDRAM requires Auto Refresh cycles at an average periodic interval of 7.8s (maximum).
Self Refresh
The Self Refresh command can be used to retain data in the DDR SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the DDR SDRAM retains data without external clocking. The Self Refresh command is initiated as an Auto Refresh command coincident with CKE transitioning low. The DLL is automatically disabled upon entering Self Refresh, and is automatically enabled upon exiting Self Refresh (200 clock cycles must then occur before a Read command can be issued). Input signals except CKE (low) are "Don't Care" during Self Refresh operation. The procedure for exiting self refresh requires a sequence of commands. CK (and CK) must be stable prior to CKE returning high. Once CKE is high, the SDRAM must have NOP commands issued for tXSNR because time is required for the completion of any internal refresh in progress. A simple algorithm for meeting both refresh and DLL requirements is to apply NOPs for 200 clock cycles before applying any other command.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Operations
Bank/Row Activation
Before any Read or Write commands can be issued to a bank within the DDR SDRAM, a row in that bank must be "opened" (activated). This is accomplished via the Active command and addresses A0-A12, BA0 and BA1 (see Activating a Specific Row in a Specific Bank), which decode and select both the bank and the row to be activated. After opening a row (issuing an Active command), a Read or Write command may be issued to that row, subject to the tRCD specification. A subsequent Active command to a different row in the same bank can only be issued after the previous active row has been "closed" (precharged). The minimum time interval between successive Active commands to the same bank is defined by tRC. A subsequent Active command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive Active commands to different banks is defined by tRRD.
Activating a Specific Row in a Specific Bank
CK CK CKE CS RAS CAS HIGH
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WE A0-A12 BA0, BA1
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RA = row address. BA = bank address. Don't Care
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RA BA
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
tRCD and tRRD Definition
CK CK Command A0-A12 BA0, BA1
ACT ROW BA x NOP ACT ROW BA y NOP NOP RD/WR COL BA y NOP NOP
tRRD
tRCD
Don't Care
Reads
Subsequent to programming the mode register with CAS latency, burst type, and burst length, Read bursts are initiated with a Read command. The starting column and bank addresses are provided with the Read command and Auto Precharge is either enabled or disabled for that burst access. If Auto Precharge is enabled, the row that is accessed starts precharge at the completion of the .com t4U.com burst, provided tRAS has been satisfied. For the generic Read commands used in the following illustrations, Auto Precharge is disabled. During Read bursts, the valid data-out element from the starting column address is available following the CAS latency after the Read command. Each subsequent data-out element is valid nominally at the next positive or negative clock edge (i.e. at the next crossing of CK and CK). The following timing figure entitled "Read Burst: CAS Latencies (Burst Length=4)" illustrates the general timing for each supported CAS latency setting. DQS is driven by the DDR SDRAM along with output data. The initial low state on DQS is known as the read preamble; the low state coincident with the last data-out element is known as the read postamble. Upon completion of a burst, assuming no other commands have been initiated, the DQs and DQS goes High-Z. Data from any Read burst may be concatenated with or truncated with data from a subsequent Read command. In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst which is being truncated. The new Read command should be issued x cycles after the first Read command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). This is shown in timing figure entitled "Consecutive Read Bursts: CAS Latencies (Burst Length =4 or 8)". A Read command can be initiated on any positive clock cycle following a previous Read command. Nonconsecutive Read data is shown in timing figure entitled "Non-Consecutive Read Bursts: CAS Latencies (Burst Length = 4)". Full-speed Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8) within a page (or pages) can be performed as shown on page 22.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Read Command
CK CK CKE CS RAS CAS WE x4: A0-A9, A11 x8: A0-A9 A10 DIS AP BA0, BA1 BA CA = column address BA = bank address EN AP = enable Auto Precharge DIS AP = disable Auto Precharge Don't Care HIGH
CA EN AP
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Read Burst: CAS Latencies (Burst Length = 4)
CAS Latency = 3
CK CK Command Address
Read
BA a,COL n
NOP
NOP
NOP
NOP
NOP
CL=3 DQS DQ QFC (Optional) tQCS
DOa-n
t QCH
Don't Care
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DO a-n = data out from bank a, column n. Shown with nominal tAC, tDQSCK, and tDQSQ. 3 subsequent elements of data out appear in.com following DO a-n. the programmed order QFC does not support in this product.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Consecutive Read Bursts: CAS Latencies (Burst Length = 4 or 8)
CAS Latency = 3
CK CK
Read
BAa, COL n
NOP
Read
NOP
NOP
NOP
BAa, COL b
CL=3 DQS DQ
DOa-n DOa-b
DO a-n (or a-b) = data out from bank a, column n (or bank a, column b). When burst length = 4, the bursts are concatenated. When burst length = 8, the second burst interrupts the first. 3 subsequent elements of data out appear in the programmed order following DO a-n. 3 (or 7) subsequent elements of data out appear in the programmed order following DO a-b. Shown with nominal tAC, tDQSCK, and tDQSQ.
Don't Care
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Non-Consecutive Read Bursts: CAS Latencies (Burst Length = 4)
CAS Latency = 3
CK CK Command Address
Read
BAa, COL n
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NOP
NOP
Read
BAa, COL b
NOP
NOP
NOP
CL=3 DQS DQ
DO a-n DOa-b
Don't Care
DO n (or b) = Data out from Column n (or Column b) Burst Length = 4 3 subsequent elements of Data out appear in the programmed order following DO n (and following DO b)
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)
CAS Latency = 3
CK CK Command Address
Read
BAa, COL n
Read
BAa, COL x
Read
BAa, COL b
Read
NOP
NOP
BAa, COL g
CL=3 DQS DQ
DOa- n DOa- n' DOa- x DOa- x' DOa- b
Don't Care
Data from any Read burst may be truncated with a Burst Terminate command, as shown in timing figure entitled .com t4U.com e Terminating a Read Burst: CAS Latencies (Burst Length = 8) on page 23. The Burst Terminate latency is equal to DataShe the read (CAS) latency, i.e. the Burst Terminate command should be issued x cycles after the Read command, where x equals the number of desired data element pairs. Data from any Read burst must be completed or truncated before a subsequent Write command can be issued. If truncation is necessary, the Burst Terminate command must be used, as shown in timing figure entitled Read to Write: CAS Latencies (Burst Length = 4 or 8) on page 24. The example is shown for tDQSS(min). The tDQSS(max) case, not shown here, has a longer bus idle time. tDQSS(min) and tDQSS(max) are defined in the section on Writes. A Read burst may be followed by, or truncated with, a Precharge command to the same bank (provided that Auto Precharge was not activated). The Precharge command should be issued x cycles after the Read command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). This is shown in timing figure Read to Precharge: CAS Latencies (Burst Length = 4 or 8) on page 25 for Read latencies of 2 and 2.5. Following the Precharge command, a subsequent command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden during the access of the last data elements. In the case of a Read being executed to completion, a Precharge command issued at the optimum time (as described above) provides the same operation that would result from the same Read burst with Auto Precharge enabled. The disadvantage of the Precharge command is that it requires that the command and address busses be available at the appropriate time to issue the command. The advantage of the Precharge command is that it can be used to truncate bursts.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Terminating a Read Burst: CAS Latencies (Burst Length = 8)
CK CK Command Address
Read
BA a,COL n
NOP
NOP
NOP
NOP
NOP
CL=3 DQS DQ
DOa-n
No Further Output data after this point .
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Read to Write: CAS Latencies (Burst Length = 4 or 8)
CAS Latency = 2
CK CK Command Address
Read
BAa, COL n
BST
NOP
Write
BAa, COL b
NOP
NOP
CL=2 DQS DQ DM
DOa-n
tDQSS (min)
DI a-b
CAS Latency = 2.5
CK
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CK Command Address
Read BST
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NOP NOP Write NOP
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BAa, COL n
BAa, COL b
CL=2.5 DQS DQ DM
DOa-n
tDQSS (min)
Dla-b
DO a-n = data out from bank a, column n . a-b = data in to bank a, column b DI 1 subsequent elements of data out appear in the programmed order following DO a-n. Data In elements are applied following Dl a-b in the programmed order, according to burst length. Shown with nominal tAC, tDQSCK, and tDQSQ.
Don't Care
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Read to Precharge: CAS Latencies (Burst Length = 4 or 8)
CAS Latency = 2
CK CK Command
Read NOP PRE NOP NOP ACT
tRP Address
BA a, COL n BA a or all BA a, ROW
CL=2 DQS DQ
DOa-n
CAS Latency = 2.5
CK CK
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Command
Read
NOP
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NOP
NOP
ACT
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tRP Address
BA a, COL n BA a or all BA a, ROW
CL=2.5 DQS DQ
DOa-n
DO a-n = data out from bank a, column n. Cases shown are either uninterrupted bursts of 4 or interrupted bursts of 8. 3 subsequent elements of data out appear in the programmed order following DO a-n. Shown with nominal tAC, tDQSCK, and tDQSQ.
Don't Care
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Writes
Write bursts are initiated with a Write command, as shown in timing figure Write Command on page 27. The starting column and bank addresses are provided with the Write command, and Auto Precharge is either enabled or disabled for that access. If Auto Precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic Write commands used in the following illustrations, Auto Precharge is disabled. During Write bursts, the first valid data-in element is registered on the first rising edge of DQS following the write command, and subsequent data elements are registered on successive edges of DQS. The Low state on DQS between the Write command and the first rising edge is known as the write preamble; the Low state on DQS following the last data-in element is known as the write postamble. The time between the Write command and the first corresponding rising edge of DQS (tDQSS) is specified with a relatively wide range (from 75% to 125% of one clock cycle), so most of the Write diagrams that follow are drawn for the two extreme cases (i.e. tDQSS(min) and tDQSS(max)). Timing figure Write Burst (Burst Length = 4) on page 28 shows the two extremes of tDQSS for a burst of four. Upon completion of a burst, assuming no other commands have been initiated, the DQs and DQS enters High-Z and any additional input data is ignored. Data for any Write burst may be concatenated with or truncated with a subsequent Write command. In either case, a continuous flow of input data can be maintained. The new Write command can be issued on any positive edge of clock following the previous Write command. The first data element from the new burst is applied after either the last element of a completed burst or the last desired data element of a longer burst which is being truncated. The new Write command should be issued x cycles after the first Write command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). Timing figure Write to Write (Burst Length = 4) on page 29 shows concatenated bursts of 4. An example of nonconsecutive Writes is shown in timing figure Write to Write: Max DQSS, Non-Consecutive (Burst Length = 4) on page 30. Fullspeed random write accesses within a page or pages can be performed as shown in timing figure Random Write Cycles (Burst Length = 2, 4 or 8) on page 31. Data for any Write burst may be followed by a subsequent Read command. To follow a Write without truncating the write burst, tWTR (Write to Read) should be met as shown in timing figure Write to Read: Non-Interrupting (CAS Latency = 2; Burst Length = 4) on page 32.
.com t4U.com "Write to Read: Interrupting (CAS Latency =2; Burst Length = 8)", "Write to Read: Minimum DQSS, Odd Number of Data (3 bit
Write), Interrupting (CAS Latency = 2; Burst Length = 8)", and "Write to Read: Nominal DQSS, Interrupting (CAS Latency = 2; Burst Length = 8)". Note that only the data-in pairs that are registered prior to the tWTR period are written to the internal array, and any subsequent data-in must be masked with DM, as shown in the diagrams noted previously. Data for any Write burst may be followed by a subsequent Precharge command. To follow a Write without truncating the write burst, tWR should be met as shown in timing figure Write to Precharge: Non-Interrupting (Burst Length = 4) on page 36. Data for any Write burst may be truncated by a subsequent Precharge command, as shown in timing figures Write to Precharge: Interrupting (Burst Length = 4 or 8) on page 37 to Write to Precharge: Nominal DQSS (2 bit Write), Interrupting (Burst Length = 4 or 8) on page 39. Note that only the data-in pairs that are registered prior to the tWR period are written to the internal array, and any subsequent data in should be masked with DM. Following the Precharge command, a subsequent command to the same bank cannot be issued until tRP is met. In the case of a Write burst being executed to completion, a Precharge command issued at the optimum time (as described above) provides the same operation that would result from the same burst with Auto Precharge. The disadvantage of the Precharge command is that it requires that the command and address busses be available at the appropriate time to issue the command. The advantage of the Precharge command is that it can be used to truncate bursts.
Data for any Write burst may be truncated by a subsequent (interrupting) Read command. This is illustrated in timing figures
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write Command
CK CK CKE CS RAS CAS WE x4: A0-A9, A11 x8: A0-A9 HIGH
CA EN AP
A10 DIS AP BA0, BA1 BA CA = column address BA = bank address EN AP = enable Auto Precharge DIS AP = disable Auto Precharge Don't Care
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write Burst (Burst Length = 4)
Maximum DQSS
T1 CK CK Command Address
Write
BA a, COL b
T2
T3
T4
NOP
NOP
NOP
tDQSS (max) DQS DQ DM tQCSW(max) QFC (Optional) tQCHW(min)
Dla-b
Minimum DQSS
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T1 CK CK Command Address
Write BA a, COL b
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T3
T4
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NOP
NOP
NOP
tDQSS (min) DQS DQ DM tQCSW(max) QFC tQCHW(max)
Dla-b
DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. A10 is Low with the Write command (Auto Precharge is disabled). QFC is an open drain driver. Its output high level is achieved through an externally connected pull up resistor connected to VDDQ. Don't Care
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Write (Burst Length = 4)
Maximum DQSS
T1 CK CK Command Address
Write NOP Write NOP NOP NOP
T2
T3
T4
T5
T6
BAa, COL b
BAa, COL n
tDQSS (max) DQS DQ DM
DI a-b DI a-n
Minimum DQSS
T1 CK CK Command Address
Write
BA, COL b
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T2
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T3
T4
T5
T6
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NOP NOP NOP
NOP
Write
BA, COL n
tDQSS (min) DQS DQ DM
DI a-b DI a-n
DI a-b = data in for bank a, column b, etc. 3 subsequent elements of data in are applied in the programmed order following DI a-b. 3 subsequent elements of data in are applied in the programmed order following DI a-n. A non-interrupted burst is shown. Each Write command may be to any bank.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Write: Max DQSS, Non-Consecutive (Burst Length = 4)
T1 CK CK Command Address
Write
T2
T3
T4
T5
NOP
NOP
Write
NOP
BAa, COL b
BAa, COL n
tDQSS (max) DQS DQ DM
DI a-b DI a-n
DI a-b, etc. = data in for bank a, column b, etc. 3 subsequent elements of data in are applied in the programmed order following DI a-b. 3 subsequent elements of data in are applied in the programmed order following DI a-n. A non-interrupted burst is shown. Each Write command may be to any bank.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Random Write Cycles (Burst Length = 2, 4 or 8)
Maximum DQSS
T1 CK CK Command Address
Write
BAa, COL b
T2
T3
T4
T5
Write
BAa, COL x
Write
BAa, COL n
Write
BAa, COL a
Write
BAa, COL g
tDQSS (max) DQS DQ DM
DI a-b DI a-b' DI a-x DI a-x' DI a-n DI a-n' DI a-a DI a-a'
Minimum DQSS
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CK CK Command Address
T1
T2 T3 .com
T4
T5
DataShee
Write
BAa, COL b
Write
BAa, COL x
Write
BAa, COL n
Write
BAa, COL a
Write
BAa, COL g
tDQSS (min) DQS DQ DM
DI a-b DI a-b' DI a-x DI a-x' DI a-n DI a-n' DI a-a DI a-a' DI a-g
DI a-b, etc. = data in for bank a, column b, etc. b', etc. = odd or even complement of b, etc. (i.e., column address LSB inverted). Each Write command may be to any bank.
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Write to Read: Non-Interrupting (CAS Latency = 2; Burst Length = 4)
Maximum DQSS
T1 CK CK Command
Write NOP NOP NOP Read NOP
T2
T3
T4
T5
T6
tWTR Address
BAa, COL b BAa, COL n
tDQSS (max) DQS DQ DM
DI a-b
CL = 2
Minimum DQSS
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CK CK Command
T1
T2
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T3
T4
T5
T6
DataShee
Write
NOP
NOP
NOP
Read
NOP
tWTR Address
BAa, COL b BAa, COL n
tDQSS (min) DQS DQ DM
DI a-b
CL = 2
DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. tWTR is referenced from the first positive CK edge after the last data in pair. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands may be to any bank.
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Write to Read: Interrupting (CAS Latency = 2; Burst Length = 8)
Maximum DQSS
T1 CK CK Command
Write NOP NOP NOP Read NOP
T2
T3
T4
T5
T6
tWTR Address
BAa, COL b BAa, COL n
tDQSS (max) DQS DQ DM
DIa- b
CL = 2
1
1
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T1 CK CK Command
Write NOP
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T2 T3 T4
Minimum DQSS
T5 T6
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NOP
NOP
Read
NOP
tWTR Address
BAa, COL b BAa, COL n
tDQSS (min) DQS DQ DM
DI a-b
CL = 2
1
1
DI a-b = data in for bank a, column b. An interrupted burst is shown, 4 data elements are written. 3 subsequent elements of data in are applied in the programmed order following DI a-b. tWTR is referenced from the first positive CK edge after the last data in pair. The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = These bits are incorrectly written into the memory array if DM is low.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Read: Minimum DQSS, Odd Number of Data (3 bit Write), Interrupting (CAS Latency = 2; Burst Length = 8)
T1 CK CK Command
Write
T2
T3
T4
T5
T6
NOP
NOP
NOP
Read
NOP
tWTR Address
BAa, COL b BAa, COL n
tDQSS (min) DQS DQ DM
DI a-b
CL = 2
1
2
2
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DI a-b = data in for bank a, column b. An interrupted burst is shown, 3 data elements are written. 2 subsequent elements of data in are applied in the programmed order following DI a-b. .com tWTR is referenced from the first positive CK edge after the last desired data in pair (not the last desired data in element) The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = This bit is correctly written into the memory array if DM is low. Don't Care 2 = These bits are incorrectly written into the memory array if DM is low.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Read: Nominal DQSS, Interrupting (CAS Latency = 2; Burst Length = 8)
T1 CK CK Command
Write
T2
T3
T4
T5
T6
NOP
NOP
NOP
Read
NOP
tWTR Address
BAa, COL b BAa, COL n
tDQSS (nom) DQS DQ DM
DI a-b
CL = 2
1
1
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.com The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = These bits are incorrectly written into the memory array if DM is low.
DI a-b = data in for bank a, column b. An interrupted burst is shown, 4 data elements are written. 3 subsequent elements of data in are applied in the programmed order following DI a-b. tWTR is referenced from the first positive CK edge after the last desired data in pair.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Precharge: Non-Interrupting (Burst Length = 4)
Maximum DQSS
T1 CK CK Command
Write NOP NOP NOP NOP PRE
T2
T3
T4
T5
T6
tWR Address
BA a, COL b BA (a or all)
tDQSS (max) DQS DQ DM
DI a-b
tRP
Minimum DQSS
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CK CK Command
T1
T2
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T3
T4
T5
T6
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Write
NOP
NOP
NOP
NOP
PRE
tWR Address
BA a, COL b BA (a or all)
tDQSS (min) DQS DQ DM
DI a-b
tRP
DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. tWR is referenced from the first positive CK edge after the last data in pair. A10 is Low with the Write command (Auto Precharge is disabled).
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Precharge: Interrupting (Burst Length = 4 or 8)
Maximum DQSS
T1 CK CK Command
Write NOP NOP NOP PRE NOP
T2
T3
T4
T5
T6
tWR Address
BA a, COL b BA (a or all)
tDQSS (max) DQS DQ DM
DI a-b
2
tRP
3
3
1
1
Minimum DQSS
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CK CK Command
T1
T2
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T3
T4
T5
T6
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Write
NOP
NOP
NOP
PRE
NOP
tWR Address
BA a, COL b BA (a or all)
tDQSS (min) DQS DQ DM
DI a-b
2
tRP
3
3
1
1
DI a-b = data in for bank a, column b. An interrupted burst is shown, 2 data elements are written. 1 subsequent element of data in is applied in the programmed order following DI a-b. tWR is referenced from the first positive CK edge after the last desired data in pair. The Precharge command masks the last 2 data elements in the burst, for burst length = 8. A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = These bits are incorrectly written into the memory array if DM is low.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Precharge: Minimum DQSS, Odd Number of Data (1 bit Write), Interrupting (Burst Length = 4 or 8)
T1 CK CK Command
Write
T2
T3
T4
T5
T6
NOP
NOP
NOP
PRE
NOP
tWR Address
BA a, COL b BA (a or all)
tDQSS (min) DQS DQ DM
DI a-b
2
tRP
3
4
4
1
1
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DI a-b = data in for bank a, column b. An interrupted burst is shown, 1 data element is written. tWR is referenced from the first positive CK edge after the last desired data in pair. .com The Precharge command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = This bit is correctly written into the memory array if DM is low. 4 = These bits are incorrectly written into the memory array if DM is low.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Write to Precharge: Nominal DQSS (2 bit Write), Interrupting (Burst Length = 4 or 8)
T1 CK CK Command
Write
T2
T3
T4
T5
T6
NOP
NOP
NOP
PRE
NOP
tWR Address
BA a, COL b BA (a or all)
tDQSS (nom) DQS DQ DM
DI a-b
2
tRP
3
3
1
1
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DI a-b = Data In for bank a, column b. An interrupted burst is shown, 2 data elements are written. 1 subsequent element of data in is applied in the programmed order following DI a-b. tWR is referenced from the first positive CK edge after the last desired data in pair. The Precharge command masks the last 2 data elements in the burst. .com A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = These bits are incorrectly written into the memory array if DM is low.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Precharge Command
CK CK CKE CS RAS CAS WE A0-A9, A11, A12 All Banks A10 BA0, BA1 One Bank BA BA = bank address (if A10 is Low, otherwise Don't Care). Don't Care HIGH
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Precharge
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The Precharge command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) is available for a subsequent row access some specified time (tRP) after the Precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are treated as "Don't Care." Once a bank has been precharged, it is in the idle state and must be activated prior to any Read or Write commands being issued to that bank.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Power Down
Power Down is entered when CKE is registered low (no accesses can be in progress). If Power Down occurs when all banks are idle, this mode is referred to as Precharge Power Down; if Power Down occurs when there is a row active in any bank, this mode is referred to as Active Power Down. Entering Power Down deactivates the input and output buffers, excluding CK, CK and CKE. The DLL is still running in Power Down mode, so for maximum power savings, the user has the option of disabling the DLL prior to entering Power Down. In that case, the DLL must be enabled after exiting Power Down, and 200 clock cycles must occur before a Read command can be issued. In Power Down mode, CKE Low and a stable clock signal must be maintained at the inputs of the DDR SDRAM, and all other input signals are "Don't Care". However, Power Down duration is limited by the refresh requirements of the device, so in most applications, the self refresh mode is preferred over the DLL-disabled Power Down mode. The Power Down state is synchronously exited when CKE is registered high (along with a Nop or Deselect command). A valid, executable command may be applied one clock cycle later.
Power Down
CK CK CKE tIS tIS
Command
VALID No column access in progress
NOP
NOP Exit power down mode tPDEX
VALID
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Enter Power Down mode (Burst Read or Write operation must not be in progress)
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Truth Table 2: Clock Enable (CKE)
1. 2. 3. 4. CKE n is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge. Current state is the state of the DDR SDRAM immediately prior to clock edge n. Command n is the command registered at clock edge n, and action n is a result of command n. All states and sequences not shown are illegal or reserved.
CKE n-1 Current State Previous Cycle L L L L H H H H CKEn Current Cycle L H L H L L L H Command n Action n Notes
Self Refresh Self Refresh Power Down Power Down All Banks Idle All Banks Idle Bank(s) Active
X Deselect or NOP X Deselect or NOP Deselect or NOP Auto Refresh Deselect or NOP See "Truth Table 3: Current State Bank n - Command to Bank n (Same Bank)" on page 43
Maintain Self-Refresh Exit Self-Refresh Maintain Power Down Exit Power Down Precharge Power Down Entry Self Refresh Entry Active Power Down Entry 1
1. Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (tXSNR) period. A minimum of 200 clock cycles are needed before applying a read command to allow the DLL to lock to the input clock.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Truth Table 3: Current State Bank n - Command to Bank n (Same Bank)
Current State Any L L Idle L L L Row Active L L Read (Auto Precharge Disabled) L L L L L L H L L L H H L H L H H H L H H L L L L H L H H L L H H H H L H L L H L L H L L No Operation Active Auto Refresh Mode Register Set Read Write Precharge Read Precharge Burst Terminate Read Write Precharge Select column and start Read burst Select column and start Write burst Deactivate row in bank(s) Select column and start new Read burst Truncate Read burst, start Precharge Burst Terminate Select column and start Read burst Select column and start Write burst Truncate Write burst, start Precharge NOP. Continue previous operation Select and activate row 1-6 1-6 1-7 1-7 1-6, 10 1-6, 10 1-6, 8 1-6, 10 1-6, 8 1-6, 9 1-6, 10, 11 1-6, 10 1-6, 8, 11 CS H RAS X CAS X WE X Command Deselect Action NOP. Continue previous operation Notes 1-6
Write (Auto Precharge Disabled)
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1. This table applies when CKE n-1 was high and CKE n is high (see Truth Table 2: Clock Enable (CKE) and after tXSNR / tXSRD has been met (if the previous state was self refresh). 2. This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those allowed .com to be issued to that bank when in that state. Exceptions are covered in the notes below. 3. Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. 4. The following states must not be interrupted by a command issued to the same bank. Precharging: Starts with registration of a Precharge command and ends when tRP is met. Once tRP is met, the bank is in the idle state. Row Activating: Starts with registration of an Active command and ends when tRCD is met. Once tRCD is met, the bank is in the "row active" state. Read w/Auto Precharge Enabled: Starts with registration of a Read command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Write w/Auto Precharge Enabled: Starts with registration of a Write command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Deselect or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and according to Truth Table 4. 5. The following states must not be interrupted by any executable command; Deselect or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an Auto Refresh command and ends when tRFC is met. Once tRFC is met, the DDR SDRAM is in the "all banks idle" state. Accessing Mode Register: Starts with registration of a Mode Register Set command and ends when tMRD has been met. Once tMRD is met, the DDR SDRAM is in the "all banks idle" state. Precharging All: Starts with registration of a Precharge All command and ends when tRP is met. Once tRP is met, all banks is in the idle state. 6. All states and sequences not shown are illegal or reserved. 7. Not bank-specific; requires that all banks are idle. 8. May or may not be bank-specific; if all/any banks are to be precharged, all/any must be in a valid state for precharging. 9. Not bank-specific; Burst terminate affects the most recent Read burst, regardless of bank. 10. Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 11. Requires appropriate DM masking.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Truth Table 4: Current State Bank n - Command to Bank m (Different bank)
(Part 1 of 2)
Current State Any L Idle X L Row Activating, Active, or Precharging L L L Read (Auto Precharge Disabled) L L L L Write (Auto Precharge Disabled) L L L H X L H H L L H L L H H L H X H L L H H L H H L L H H X H H L L H H L H H L L No Operation Any Command Otherwise Allowed to Bank m Active Read Write Precharge Active Read Precharge Active Read Write Precharge Select and activate row Select column and start Read burst Select column and start new Write burst Select and activate row Select column and start new Read burst Select and activate row Select column and start Read burst Select column and start Write burst NOP/continue previous operation 1-6 1-6 1-6 1-7 1-7 1-6 1-6 1-7 1-6 1-6 1-8 1-7 1-6 CS H RAS X CAS X WE X Command Deselect Action NOP/continue previous operation Notes 1-6
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1. This table applies when CKE n-1 was high and CKE n .com 2: Clock Enable (CKE) and after tXSNR / tXSRD has been is high (see Truth Table met (if the previous state was self refresh). 2. This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3. Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Read with Auto Precharge Enabled: See note 10. Write with Auto Precharge Enabled: See note 10. 4. Auto Refresh and Mode Register Set commands may only be issued when all banks are idle. 5. A Burst Terminate command cannot be issued to another bank; it applies to the bank represented by the current state only. 6. All states and sequences not shown are illegal or reserved. 7. Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 8. Requires appropriate DM masking. 9. A Write command may be applied after the completion of data output. 10. The Read with Auto Precharge enabled or Write with Auto Precharge enabled states can each be broken into two parts: the access period and the precharge period. For Read with Auto Precharge, the precharge period is defined as if the same burst was executed with Auto Precharge disabled and then followed with the earliest possible Precharge command that still accesses all of the data in the burst. For Write with Auto Precharge, the precharge period begins when tWR ends, with tWR measured as if Auto Precharge was disabled. The access period starts with registration of the command and ends where the precharge period (or tRP) begins. During the precharge period of the Read with Auto Precharge Enabled or Write with Auto Precharge Enabled states, Active, Precharge, Read, and Write commands to the other bank may be applied; during the access period, only Active and Precharge commands to the other bank may be applied. In either case, all other related limitations apply (e.g. contention between Read data and Write data must be avoided).
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Truth Table 4: Current State Bank n - Command to Bank m (Different bank)
(Part 2 of 2)
Current State CS L Read (With Auto Precharge) L L L L Write (With Auto Precharge) L L L RAS L H H L L H H L CAS H L L H H L L H WE H H L L H H L L Command Active Read Write Precharge Active Read Write Precharge Select and activate row Select column and start Read burst Select column and start new Write burst Action Select and activate row Select column and start new Read burst Select column and start Write burst Notes 1-6 1-7,10 1-7,9,10 1-6 1-6 1-7,10 1-7,10 1-6
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1. This table applies when CKE n-1 was high and CKE n is high (see Truth Table 2: Clock Enable (CKE) and after tXSNR / tXSRD has been met (if the previous state was self refresh). 2. This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3. Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Read with Auto Precharge Enabled: See note 10. .com Write with Auto Precharge Enabled: See note 10. 4. Auto Refresh and Mode Register Set commands may only be issued when all banks are idle. 5. A Burst Terminate command cannot be issued to another bank; it applies to the bank represented by the current state only. 6. All states and sequences not shown are illegal or reserved. 7. Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 8. Requires appropriate DM masking. 9. A Write command may be applied after the completion of data output. 10. The Read with Auto Precharge enabled or Write with Auto Precharge enabled states can each be broken into two parts: the access period and the precharge period. For Read with Auto Precharge, the precharge period is defined as if the same burst was executed with Auto Precharge disabled and then followed with the earliest possible Precharge command that still accesses all of the data in the burst. For Write with Auto Precharge, the precharge period begins when tWR ends, with tWR measured as if Auto Precharge was disabled. The access period starts with registration of the command and ends where the precharge period (or tRP) begins. During the precharge period of the Read with Auto Precharge Enabled or Write with Auto Precharge Enabled states, Active, Precharge, Read, and Write commands to the other bank may be applied; during the access period, only Active and Precharge commands to the other bank may be applied. In either case, all other related limitations apply (e.g. contention between Read data and Write data must be avoided).
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Simplified State Diagram
Power Applied Power On
Precharge Preall
Self Refresh REFS REFSX
MRS EMRS
MRS
Idle
REFA
Auto Refresh
CKEL CKEH
Active Power Down CKEH CKEL
ACT
Precharge Power Down
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Write
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Row Active Read
Burst Stop
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Write A Write
Read A Read Read
Write A Read A Write A PRE PRE PRE
Read A
Read A
PRE
Precharge Preall Automatic Sequence Command Sequence
PREALL = Precharge All Banks MRS = Mode Register Set EMRS = Extended Mode Register Set REFS = Enter Self Refresh REFSX = Exit Self Refresh REFA = Auto Refresh
CKEL = Enter Power Down CKEH = Exit Power Down ACT = Active Write A = Write with Autoprecharge Read A = Read with Autoprecharge PRE = Precharge
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Absolute Maximum Ratings
Symbol VIN, VOUT VIN VDD VDDQ TA TSTG PD IOUT Parameter Voltage on I/O pins relative to VSS Voltage on Inputs relative to VSS Voltage on VDD supply relative to VSS Voltage on VDDQ supply relative to VSS Operating Temperature (Ambient) Storage Temperature (Plastic) Power Dissipation Short Circuit Output Current Rating Units V V V V
-0.5 to VDDQ+ 0.5 -0.5 to +3.6 -0.5 to +3.6 -0.5 to +3.6
0 to +70
C C
W mA
-55 to +150
1.0 50
Note: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Capacitance
Parameter Input Capacitance: CK, CK Delta Input Capacitance: CK, CK Input Capacitance: All other input-only pins (except DM) Delta Input Capacitance: All other input-only pins (except DM) Input/Output Capacitance: DQ, DQS, DM Delta Input/Output Capacitance: DQ, DQS, DM Symbol CI1 delta CI1 CI2 delta CI2 CIO delta CIO 4.0 2.0 Min. 2.0 Max. 3.0 0.25 3.0 0.5 5.0 0.5 Units pF pF pF pF pF pF Notes 1 1 1 1 1, 2 1
1. VDDQ = VDD = 2.5V 0.2V (minimum range to maximum range), f = 100MHz, TA = 25C, VODC = VDDQ/2, VOPeak -Peak = 0.2V. 2. Although DM is an input-only pin, the input capacitance of this pin must model the input capacitance of the DQ and DQS pins. This is required to match input propagation times of DQ, DQS and DM in the system.
DC Electrical Characteristics and Operating Conditions
(0 C TA 70 C; VDDQ = VDD = + 2.6V 0.1V, see AC Characteristics)
Symbol VDD VDD VDDQ
Parameter Supply Voltage DDR266/333 Supply Voltage DDR400 I/O Supply Voltage DDR266/333 I/O Supply Voltage DDR400 Supply Voltage I/O Supply Voltage I/O Reference Voltage I/O Termination Voltage (System) Input High (Logic1) Voltage Input Low (Logic0) Voltage Input Voltage Level, CK and CK Inputs Input Differential Voltage, CK and CK Inputs Input Crossing Point Voltage, CK and CK Inputs V-I Matching Pullup Current to Pulldown Current Ratio Input Leakage Current Any input 0V VIN VDD; (All other pins not under test = 0V) Output Leakage Current (DQs are disabled; 0V Vout VDDQ
Min 2.3 2.5 2.3 2.5
Max 2.7 2.7 2.7 2.7 0 0.51 x VDDQ VREF + 0.04 VDDQ + 0.3 VREF - 0.15 VDDQ + 0.3 VDDQ + 0.6 VDDQ + 0.6 1.4 2 5
Units V V V V V V V V V V V V
Notes 1 1 1 1
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VDDQ VSS, VSSQ VREF VTT VIH(DC) VIL(DC) VIN(DC) VID(DC) VIX(DC) VIRatio II IOZ
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0 0.49 x VDDQ VREF - 0.04 VREF + 0.15 - 0.3 - 0.3 0.30 0.30 0.71 -2 -5 1, 2 1, 3 1 1 1 1, 4 1, 4 5 A A 1 1
DataShee
1. Inputs are not recognized as valid until VREF stabilizes. 2. VREF is expected to be equal to 0.5 VDDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed 2% of the DC value. 3. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. 4. VID is the magnitude of the difference between the input level on CK and the input level on CK. 5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltages for 0.25 volts to 1.0 volts. For a given output, it represents the maximum difference between pullup and pulldown drivers due to process variation.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
DC Electrical Characteristics and Operating Conditions
(0 C TA 70 C; VDDQ = VDD = + 2.6V 0.1V, see AC Characteristics)
Symbol IOH IOL IOHW IOLW
Parameter Output Current: Nominal Strength Driver High current (VOUT= VDDQ -0.373V, min VREF, min VTT) Low current (VOUT= 0.373V, max VREF, max VTT) Output Current: Half- Strength Driver High current (VOUT= VDDQ -0.763V, min VREF, min VTT) Low current (VOUT= 0.763V, max VREF, max VTT)
Min - 16.8
Max
Units mA
Notes 1
16.8 - 9.0 mA 9.0 1
1. Inputs are not recognized as valid until VREF stabilizes. 2. VREF is expected to be equal to 0.5 VDDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed 2% of the DC value. 3. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. 4. VID is the magnitude of the difference between the input level on CK and the input level on CK. 5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltages for 0.25 volts to 1.0 volts. For a given output, it represents the maximum difference between pullup and pulldown drivers due to process variation.
Normal Strength Driver Pulldown and Pullup Characteristics
1. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve. 2. It is recommended that the "typical" IBIS pulldown V-I curve lie within the shaded region of the V-I curve.
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Normal Strength Driver Pulldown Characteristics
140
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Maximum
DataShee
IOUT (mA)
Typical High Typical Low Minimum
0
0 VOUT (V)
2.7
3. The full variation in driver pullup current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve. 4. It is recommended that the "typical" IBIS pullup V-I curve lie within the shaded region of the V-I curve.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Normal Strength Driver Pullup Characteristics
0 Minimum IOUT (mA) Typical Low
Typical High -200 0 VOUT (V)
5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7, for device drain to source voltages from 0.1 to 1.0. 6. The full variation in the ratio of the "typical" IBIS pullup to "typical" IBIS pulldown current should be unity + 10%, for device drain to source voltages from 0.1 to 1.0. This specification is a design objective only. It is not guaranteed. 7. These characteristics are intended to obey the SSTL_2 class II standard. 8. This specification is intended for DDR SDRAM only.
Maximum 2.7
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DataShee
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Normal Strength Driver Pulldown and Pullup Currents
Pulldown Current (mA) Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 Typical Low 6.0 12.2 18.1 24.1 29.8 34.6 39.4 43.7 47.5 51.3 54.1 56.2 57.9 59.3 60.1 60.5 61.0 61.5 62.0 62.5 62.9 63.3 63.8 64.1 64.6 64.8 65.0 Typical High 6.8 13.5 20.1 26.6 33.0 39.1 44.2 49.8 55.2 60.3 65.2 69.9 74.2 78.4 82.3 85.9 89.1 92.2 95.3 97.2 99.1 100.9 101.9 102.8 103.8 104.6 105.4 Min 4.6 9.2 13.8 18.4 23.0 27.7 32.2 36.8 39.6 42.6 44.8 46.2 47.1 47.4 47.7 48.0 48.4 48.9 49.1 49.4 49.6 49.8 49.9 50.0 50.2 50.4 50.5 Max 9.6 18.2 26.0 33.9 41.8 49.4 56.8 63.2 69.9 76.3 82.5 88.3 93.8 99.1 Typical Low -6.1 -12.2 -18.1 -24.0 -29.8 -34.3 -38.1 -41.1 -43.8 -46.0 -47.8 -49.2 -50.0 -50.5 -50.7 -51.0 -51.1 -51.3 -51.5 -51.6 -51.8 -52.0 -52.2 -52.3 -52.5 -52.7 -52.8 Pullup Current (mA) Typical High -7.6 -14.5 -21.2 -27.7 -34.1 -40.5 -46.9 -53.1 -59.4 -65.5 -71.6 -77.6 -83.6 -89.7 -95.5 -101.3 -107.1 -112.4 -118.7 -124.0 -129.3 -134.6 -139.9 -145.2 -150.5 -155.3 -160.1 Min -4.6 -9.2 -13.8 -18.4 -23.0 -27.7 -32.2 -36.0 -38.2 -38.7 -39.0 -39.2 -39.4 -39.6 -39.9 -40.1 -40.2 -40.3 -40.4 -40.5 -40.6 -40.7 -40.8 -40.9 -41.0 -41.1 -41.2 Max -10.0 -20.0 -29.8 -38.8 -46.8 -54.4 -61.8 -69.5 -77.3 -85.2 -93.0 -100.6 -108.1 -115.5 -123.0 -130.4 -136.7 -144.2 -150.5 -156.9 -163.2 -169.6 -176.0 -181.3 -187.6 -192.9 -198.2
t4U.com
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
.com
108.4 112.1 115.9 119.6 123.3 126.5 129.5 132.4 135.0 137.3 139.2 140.8
103.8
DataShee
Normal Strength Driver Evaluation Conditions
Typical Temperature (Tambient) VDDQ Process conditions 25 C 2.5V typical process Minimum 70 C 2.3V slow-slow process Maximum 0 C 2.7V fast-fast process
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
AC Characteristics
(Notes 1-5 apply to the following Tables; Electrical Characteristics and DC Operating Conditions, AC Operating Conditions, IDD Specifications and Conditions, and Electrical Characteristics and AC Timing.) 1. All voltages referenced to VSS. 2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. Outputs measured with equivalent load. Refer to the AC Output Load Circuit below. 4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK, CK), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate for the input signals is 1V/ns in the range between VIL(AC) and VIH(AC). 5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the receiver effectively switches as a result of the signal crossing the AC input level, and remains in that state as long as the signal does not ring back above (below) the DC input low (high) level.
AC Output Load Circuit Diagrams
VTT
50 Output (VOUT) Timing Reference Point
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30pF
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
AC Input Operating Conditions
Symbol VIH(AC) VIL(AC) VID(AC) VIX(AC) 1. 2. 3. 4.
(0 C TA 70 C; VDD = VDDQ = 2.6V 0.1V; See AC Characteristics)
Parameter/Condition Input High (Logic 1) Voltage, DQ, DQS, and DM Signals Input Low (Logic 0) Voltage, DQ, DQS, and DM Signals Input Differential Voltage, CK and CK Inputs Input Crossing Point Voltage, CK and CK Inputs
Min VREF + 0.31
Max
Unit V
Notes 1, 2 1, 2 1, 2, 3 1, 2, 4
VREF - 0.31 0.62 0.5*VDDQ - 0.2 VDDQ + 0.6 0.5*VDDQ + 0.2
V V V
Input slew rate = 1V/ns. Inputs are not recognized as valid until VREF stabilizes. VID is the magnitude of the difference between the input level on CK and the input level on CK. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same.
IDD Specifications and Conditions
Symbol
(0 C TA 70 C; VDD = VDDQ = 2.6V 0.1V; See AC Characteristics)
Parameter/Condition Operating Current: one bank; active / precharge; tRC = tRC (min); DQ, DM, and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle Operating Current: one bank; active / read / precharge; Burst = 2; tRC = tRC (min); CL = 2.5; IOUT = 0mA; address and control inputs changing once .com per clock cycle Precharge Power Down Standby Current: all banks idle; Power Down mode; CKE VIL (max) Idle Standby Current: CS VIH (min); all banks idle; CKE VIH (min); address and control inputs changing once per clock cycle Active Power Down Standby Current: one bank active; Power Down mode; CKE VIL (max) Active Standby Current: one bank; active / precharge; CS VIH (min); CKE VIH (min); tRC = tRAS (max); DQ, DM, and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle Operating Current: one bank; Burst = 2; reads; continuous burst; address and control inputs changing once per clock cycle; DQ and DQS outputs changing twice per clock cycle; CL = 2.5; IOUT = 0mA Operating Current: one bank; Burst = 2; writes; continuous burst; address and control inputs changing once per clock cycle; DQ and DQS inputs changing twice per clock cycle; CL = 2.5 Auto-Refresh Current: tRC = tRFC (min) Self-Refresh Current: CKE 0.2V Operating current: four bank; four bank interleaving with BL = 4, address and control inputs randomly changing; 50% of data changing at every transfer; t RC = t RC (min); I OUT = 0mA.
DDR400 (5T) Unit Notes tCK=5ns TBD mA 1
IDD0
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IDD1
TBD
mA
1
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IDD2P IDD2N
TBD TBD
mA mA
1 1
IDD3P
TBD
mA
1
IDD3N
TBD
mA
1
IDD4R
TBD
mA
1
IDD4W IDD5 IDD6
TBD TBD TBD
mA mA mA
1 1 1, 2
IDD7
TBD
mA
1
1. IDD specifications are tested after the device is properly initialized. 2. Enables on-chip refresh and address counters. Values are averaged from high and low temp values using x16 devices.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Electrical Characteristics & AC Timing - Absolute Specifications
(0 C TA 70 C; VDD = VDDQ = 2.6V 0.1V; See AC Characteristics) DDR400 (5T) Symbol tAC Parameter Min DQ output access time from CK/CK - 0.7 - 0.6 0.45 0.45 CL = 3.0 5 0.4 0.4 2.2 1.75 + 0.7 - 0.7 BGA Package min (tCL, tCH) tHP - tQHS BGA .com Package 0.72 0.35 0.35 0.2 0.2 2 0 0.40 max(0.25* tCK, 1.5ns) 0.6 0.6 0.7 0.7 0.9 0.40 40 55 70 1.1 0.60 70,000 0.60 0.5 1.28 + 0.7 + 0.4 Max + 0.7 + 0.6 0.55 0.55 8 ns ns tCK tCK ns ns ns ns ns ns ns ns tCK ns ns tCK tCK tCK tCK tCK tCK ns tCK tCK ns ns ns 1-4 1-4 1-4 1-4 1-4 1-4, 15, 16 1-4, 15, 16 2-4, 12 1-4 1-4, 5 1-4, 5 1-4 1-4 1-4 1-4 1-4 1-4 1-4 1-4 1-4 1-4 1-4, 7 1-4, 6 1-4 2-4, 9, 11, 12 2-4, 9, 11, 12 2-4, 10-12, 14 Unit Notes
tDQSCK DQS output access time from CK/CK tCH tCL tCK tDH tDS tIPW tDIPW tHZ tLZ CK high-level width CK low-level width Clock cycle time DQ and DM input hold time DQ and DM input setup time Input pulse width DQ and DM input pulse width (each input) Data-out high-impedance time from CK/CK Data-out low-impedance time from CK/CK
DQS-DQ skew tDQSQ (DQS & associated DQ signals) tHP tQH Minimum half clk period for any given cycle; defined by clk high (tCH) or clk low (tCL) time Data output hold time from DQS Data hold Skew Factor Write command to 1st DQS latching transition DQS input high pulse width (write cycle) DQS input low pulse width (write cycle) DQS falling edge to CK setup time (write cycle) DQS falling edge hold time from CK (write cycle) Mode register set command cycle time
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tQHS tDQSS tDQSH tDQSL tDSS tDSH tMRD
DataShee
tWPRES Write preamble setup time tWPST Write postamble
tWPRE Write preamble tIH tIS tIH tIS tRPRE tRPST tRAS tRC tRFC Address and control input hold time (fast slew rate) Address and control input setup time (fast slew rate) Address and control input hold time (slow slew rate) Address and control input setup time (slow slew rate) Read preamble Read postamble Active to Precharge command Active to Active/Auto-refresh command period Auto-refresh to Active/Auto-refresh command period
ns 2-4, 10, 11, 12, 14 tCK tCK ns ns ns 1-4 1-4 1-4 1-4 1-4
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Electrical Characteristics & AC Timing - Absolute Specifications
(0 C TA 70 C; VDD = VDDQ = 2.6V 0.1V; See AC Characteristics) DDR400 (5T) Symbol tRCD tRAP tRP tRRD tWR tDAL tWTR tPDEX tXSNR tXSRD tREFI Active to Read or Write delay Active to Read Command with Autoprecharge Precharge command period Active bank A to Active bank B command Write recovery time Auto precharge write recovery + precharge time Internal write to read command delay Power down exit time Exit self-refresh to non-read command Exit self-refresh to read command Average Periodic Refresh Interval Parameter Min 15 min (tRCD, tRAS) 15 10 15 (tWR/tCK) + (tRP/tCK) 2 5 75 200 7.8 Max ns ns ns ns ns tCK tCK ns ns tCK s 1-4 1-4 1-4 1-4 1-4 1-4, 13 1-4 1-4 1-4 1-4 1-4, 8 Unit Notes
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Electrical Characteristics & AC Timing - Absolute Specifications Notes
1. Input slew rate = 1V/ns. 2. The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross; the input reference level for signals other than CK/CK is VREF. 3. Inputs are not recognized as valid until VREF stabilizes. 4. The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (Note 3) is VTT. 5. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ). 6. The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. 7. The specific requirement is that DQS be valid (high, low, or some point on a valid transition) on or before this CK edge. A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from high to low at this time, depending on tDQSS. 8. A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. 9. For command/address input slew rate 1.0V/ns. Slew rate is measured between VOH (AC) and VOL (AC). 10. For command/address input slew rate 0.5V/ns and < 1.0V/ns. Slew rate is measured between VOH (AC) and VOL (AC). 11. CK/CK slew rates are 1.0V/ns. 12. These parameters guarantee device timing, but they are not necessarily tested on each device, and they may be guaranteed by design or tester characterization. t4U.com 13. For each of the terms in parentheses, if not .com round to the next highest integer. tCK is equal DataShee already an integer, to the actual system clock cycle time. tDAL = (tWR/tCK) + (tRP/tCK).
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
14. An input setup and hold time derating table is used to increase tIS and tIH in the case where the input slew rate is below 0.5 V/ns.
Input Slew Rate 0.5 V/ns 0.4 V/ns 0.3 V/ns delta (tIS) 0 +50 +100 delta (tIH) 0 0 0 Unit ps ps ps Notes 1,2 1,2 1,2
1. Input slew rate is based on the lesser of the slew rates determined by either V IH (AC) to V IL (AC) or V IH (DC) to V IL (DC), similarly for rising transitions. 2. These derating parameters may be guaranteed by design or tester characterization and are not necessarily tested on each device.
15. An input setup and hold time derating table is used to increase tDS and tDH in the case where the I/O slew rate is below 0.5 V/ns.
Input Slew Rate 0.5 V/ns 0.4 V/ns 0.3 V/ns delta (tDS) 0 +75 +150 delta (tDH) 0 +75 +150 Unit ps ps ps Notes 1,2 1,2 1,2
1. I/O slew rate is based on the lesser of the slew rates determined by either V IH (AC) to V IL (AC) or V IH (DC) to V IL (DC), similarly for rising transitions. 2. These derating parameters may be guaranteed by design or tester characterization and are not necessarily tested on each device.
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.com 16. An I/O Delta Rise, Fall Derating table is used to increase tDS and tDH in the case where DQ, DM, and DQS
slew rates differ.
Input Slew Rate 0.0 V/ns 0.25 V/ns 0.5 V/ns delta (tDS) 0 +50 +100 delta (tDH) 0 +50 +100 Unit ps ps ps Notes 1,2,3,4 1,2,3,4 1,2,3,4
DataShee
1. Input slew rate is based on the lesser of the slew rates determined by either V IH (AC) to V IL (AC) or V IH (DC) to V IL (DC), similarly for rising transitions. 2. Input slew rate is based on the larger of AC to AC delta rise, fall rate and DC to DC delta rise, fall rate. 3. The delta rise, fall rate is calculated as: [1/(slew rate 1)] - [1/(slew rate 2)] For example: slew rate 1 = 0.5 V/ns; slew rate 2 = 0.4 V/ns Delta rise, fall = (1/0.5) - (1/0.4) [ns/V] = -0.5 ns/V Using the table above, this would result in an increase in t DS and t DH of 100 ps. 4. These derating parameters may be guaranteed by design or tester characterization and are not necessarily tested on each device.
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Data Input (Write)
(Timing Burst Length = 4)
tDSL tDSH DQS tDH tDS DQ
DI n
tDH tDS DM
DI n = Data In for column n. 3 subsequent elements of data in are applied in programmed order following DI n.
Don't Care
Data Output (Read)
CK
t4U.com
(Timing Burst Length = 4)
CK DQS
tHP
tHP
tHP .comtHP2 tHP1
tHP3
tHP4
DataShee
tDQSQ tQH1 DQ tDQSQ
tQH2
tDQSQ tQH3
tQH4
tDQSQ
tHP is the half cycle pulse width for each half cycle clock. tHP is referenced to the clock duty cycle only and not to the data strobe (DQS) duty cycle. Data Output hold time from Data Strobe is shown as tQH. tQH is a function of the clock high or low time (tHP) for that given clock cycle. Note correlation of tHP to tQH in the diagram above (tHP1 to tQH1, etc.). tDQSQ (max) occurs when DQS is the earliest among DQS and DQ signals to transition.
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* VTT is not applied directly to the device, however tVTD must be greater than or equal to zero to avoid device latchup. ** tMRD is required before any command can be applied and 200 cycles of CK are required before a Read command can be applied. The two Autorefresh commands may be moved to follow the first MRS, but precede the second Precharge All command.
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tVTD tCK tCH
VDD
NT5DS128M4CG
VDDQ
VTT (System*)
VREF
200 cycles of CK**
tCL tMRD tMRD tRP tRFC tRFC tMRD
512Mb DDR SDRAM C-Die
200s
Initialize and Mode Register Sets
CK CK
tIH tIS
CKE
tIH tIS NOP PRE EMRS MRS PRE AR AR
LVCMOS LOW LEVEL
Command
MRS
ACT
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Preliminary
59
tIH tIS CODE tIH tIS CODE CODE tIS tIS tIH tIH CODE
DM
A0-A9, A11
CODE
RA
A10
ALL BANKS
tIH tIS BA0=H BA1=L BA0=L BA1=L
CODE
RA
ALL BANKS
BA0, BA1
BA0=L BA1=L
BA
High-Z
DQS
High-Z
DQ
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Don't Care
Extended Mode Register Set
Load Mode Register, Reset DLL
Load Mode Register (with A8 = L)
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Power Down Mode
January 23, 2006 tCK tCH tCL tPDEX tIH tIS tIS tIH NOP NOP VALID tIH VALID
NT5DS128M4CG
CK
CK
512Mb DDR SDRAM C-Die
tIS
CKE
tIS
Command
VALID*
tIS
ADDR
VALID
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Preliminary
60
Enter Power Down Mode
DQS
DQ
DM
Exit Power Down Mode
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No column accesses are allowed to be in progress at the time power down is entered. * = If this command is a Precharge (or if the device is already in the idle state) then the power down mode shown is Precharge power down. If this command is an Active (or if at least one row is already active), then the power down mode shown is Active power down.
Don't Care
DataShee
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tRP tCH tCK tRFC tRFC tCL
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NT5DS128M4CG
Auto Refresh Mode
CK CK
tIH
512Mb DDR SDRAM C-Die
tIS VALID VALID
CKE
tIH
tIS PRE NOP NOP AR NOP AR NOP NOP ACT
Command
NOP
A0-A8
RA
A9, A11,A12
RA
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Preliminary
61
tIH tIS
ALL BANKS
A10
RA
ONE BANK
BA0, BA1
BANK(S)
BA
DQS
DQ
DM
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address; AR = Autorefresh. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. DM, DQ, and DQS signals are all don't care/high-Z for operations shown.
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Don't Care
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Clock must be stable before exiting Self Refresh Mode
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NT5DS128M4CG
tRP* tCK tCH tCL
Self Refresh Mode
200 cycles
512Mb DDR SDRAM C-Die
CK CK
tIH tIS tIS
tIS
CKE
tIH tXSRD, tXSRN AR NOP VALID
tIS
Command
NOP
tIH tIS VALID
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Preliminary
62
Enter Self Refresh Mode
ADDR
DQS
DQ
DM
Exit Self Refresh Mode
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
* = Device must be in the all banks idle state before entering Self Refresh Mode. ** = tXSNR is required before any non-read command can be applied, and tXSRD (200 cycles of CK). are required before a Read command can be applied.
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DataShee
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tCK tCH tRP
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tCL
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tIH tIS VALID tIH tIS NOP NOP PRE NOP NOP ACT NOP NOP NOP tIH tIS Read VALID VALID tIH
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January 23, 2006
COL n
RA tIH tIS
CK CK
NT5DS128M4CG
CKE
512Mb DDR SDRAM C-Die
Command
A0-A9, A11, A12
ALL BANKS
RA
A10
DIS AP ONE BANK
tIH tIS BA x BA x* BA x
BA0, BA1
Read without Auto Precharge (Burst Length = 4)
Case 1: tAC/tDQSCK = min
tAC (min) tRPST tDQSCK (min)
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Preliminary
63
tLZ (min) tRPRE tHZ (min)
DM
DQS
CL=2 DO n
tLZ (max) tRPRE
DQ
DQS
tAC (max) tLZ (max) tHZ (max) tRPST tDQSCK (max)
Case 2: tAC/tDQSCK = max
DQ
DO n
DO n = data out from column n.
3 subsequent elements of data out are provided in the programmed order following DO n.
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DIS AP = Disable Auto Precharge. * = Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address.
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
NOP commands are shown for ease of illustration; other commands may be valid at these times.
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tCK tCH tRP
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tCL
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tIH tIS VALID tIH tIS VALID VALID tIH
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January 23, 2006
NOP
Read tIH tIS COL n tIH tIS RA RA NOP NOP NOP NOP ACT NOP NOP NOP
CK CK
NT5DS128M4CG
CKE
512Mb DDR SDRAM C-Die
Command
A0-A9, A11, A12
A10
EN AP
tIH tIS BA x BA x
BA0, BA1
Read with Auto Precharge (Burst Length = 4)
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Preliminary
64
tLZ (min) tRPRE tHZ (min) tAC (min) tRPST tDQSCK (min) tHZ (min)
DM
DQS
Case 1: tAC/tDQSCK = min
CL=2 DO n
tLZ (max) tRPRE
DQ
DQS
tAC (max) tLZ (max) tHZ (max) tRPST tDQSCK (max)
Case 2: tAC/tDQSCK = max
DQ
DO n
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
DO n = data out from column n. 3 subsequent elements of data out are provided in the programmed order following DO n. EN AP = enable Auto Precharge. ACT = active; RA = row address. NOP commands are shown for ease of illustration; other commands may be valid at these times.
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tCK tCH
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tCL
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tIH tIS VALID tIH tIS NOP NOP Read NOP PRE NOP NOP ACT NOP tIH tIS RA COL n tIH tIS ALL BANKS RA ONE BANK RA ACT tRC
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January 23, 2006
RA DIS AP
tIH tIS BA x BA x BA x*
CK CK
NT5DS128M4CG
CKE
512Mb DDR SDRAM C-Die
Command
A0-A9, A11, A12
Bank Read Access (Burst Length = 4)
A10
BA0, BA1
BA x
DM
tLZ (min) tRPRE tRP
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Preliminary
65
tRCD tRAS tLZ (min) tAC (min) tRPST tDQSCK (min)
DQS
Case 1: tAC/tDQSCK = min
CL=2 DO n
tLZ (max) tRPRE
tHZ (min)
DQ
DQS
tHZ (max) tAC (max) tLZ (max) tRPST tDQSCK (max)
Case 2: tAC/tDQSCK = max
DQ
DO n
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
DO n = data out from column n. 3 subsequent elements of data out are provided in the programmed order following DO n. DIS AP = disable Auto Precharge. * = Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other commands may be valid at these times.
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tCH tCK tCL tRP tWR
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CK
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January 23, 2006
tIH VALID Write NOP NOP NOP NOP PRE NOP NOP ACT tIH tIS COL n RA tIH tIS
CK
tIH
NT5DS128M4CG
tIS
CKE
tIH
tIS
512Mb DDR SDRAM C-Die
Command
NOP
A0-A9, A11, A12
ALL BANKS
RA
A10 ONE BANK
tIH tIS BA x tWPRE tWPRES tDQSH tDQSS tWPST tDQSL tDSH BA x*
DIS AP
Write without Auto Precharge (Burst Length = 4)
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Preliminary
66
DIn
BA0, BA1
BA
DQS
DQ
DM
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
tDQSS = min. DIn = Data in for column n. 3 subsequent elements of data in are applied in the programmed order following DIn. DIS AP = Disable Auto Precharge. * = Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
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tCH tCK tCL tRP tWR
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tDAL
CK
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January 23, 2006
VALID VALID VALID Write NOP NOP NOP NOP NOP NOP NOP ACT tIH tIS COL n tIH tIS RA
CK
tIH
NT5DS128M4CG
tIS
CKE
tIH
512Mb DDR SDRAM C-Die
tIS
Command
NOP
A0-A9, A11, A12
A10
tIH tIS BA x
EN AP
RA
Write with Auto Precharge (Burst Length = 4)
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Preliminary
67
tWPRES tDSH tDQSS tDQSH tDQSL tWPST DIn tWPRE
BA0, BA1
BA
DQS
DQ
DM
tDQSS = min.
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
DIn = Data in for column n. 3 subsequent elements of data in are applied in the programmed order following DIn. EN AP = Enable Auto Precharge. ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
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tCH tCK tCL
DataSheet 4 U .com
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January 23, 2006
VALID tRAS ACT NOP Write NOP NOP NOP NOP PRE NOP tIH tIS RA Col n
CK
CK
NT5DS128M4CG
tIH
tIS
CKE
tIH
512Mb DDR SDRAM C-Die
tIS
Command
NOP
Bank Write Access (Burst Length = 4)
A0-A9, A11, A12
tIH tIS RA
ALL BANKS ONE BANK
A10
tIH tIS BA x tRCD tWPRES tDQSH tDQSS tDQSL tWPST tDSH BA x
DIS AP
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Preliminary
68
DIn tWPRE
BA0, BA1
BA x
tWR
DQS
DQ
DM
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
tDQSS = min. DI n = data in for column n. 3 subsequent elements of data in are applied in the programmed order following DI n. DIS AP = Disable Auto Precharge. * = don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
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tCH tCK tCL
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CK
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January 23, 2006
VALID Write NOP NOP NOP NOP PRE NOP NOP ACT tIH tIS COL n RA
CK
tIH
NT5DS128M4CG
tIS
CKE
tIH
tIS
512Mb DDR SDRAM C-Die
Command
NOP
A0-A9, A11, A12
tIH tIS
Write DM Operation (Burst Length = 4)
ALL BANKS
RA
A10 ONE BANK
tIH tIS BA x BA x*
DIS AP
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Preliminary
69
tWPRES tDQSH tDQSS tDQSL tWPST tDSH tWR DIn
BA0, BA1
BA
tRP
DQS
DQ
DM
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
DI n = data in for column n. 3 subsequent elements of data in are applied in the programmed order following DI n (the second element of the 4 is masked). DIS AP = Disable Auto Precharge. * = Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. tDQSS = min.
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DataShee
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
Package Dimensions (60 balls; 0.8mmx1.0mm Pitch; wBGA Package)
10.0 0.80
1.00 Dia. 0.40 min. 0.50 max. 12.0
0.25 min. 0.40 max. 1.20 max.
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DataShee
Note : All dimensions are typical unless otherwise stated . Unit : Millimeters
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70
(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
DataSheet 4 U .com
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Revision Log
Rev 0.1 Date January 2004
Preliminary Release
Modification
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DataSheet 4 U .com
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NT5DS128M4CG 512Mb DDR SDRAM C-Die Preliminary
(R)
Nanya Technology Corporation. All rights reserved. Printed in Taiwan, R.O.C. The following are trademarks of NANYA TECHNOLOGY CORPORATION: NANYA and the NANYA logo
Other company, product and service names may be trademarks or service marks of others.
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NANYA TECHNOLOGY CORPORATION (NTC) reserves the right to make changes without notice. NTC warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with NTC's standard warranty. Testing and other quality control techniques are utilize to the extent NTC deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
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Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage ("Critical Applications"). NTC SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTEND, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. Inclusion of NTC products in such applications is understood to be fully at the risk of the customer. Use of NTC products in such applications requires the written approval of an appropriate NTC officer. Question concerning potential risk applications should be directed to NTC through a local sales office. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards should be provided by customer to minimize the inherent or procedural hazards. NTC assumes no liability of applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does NTC warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of NTC covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.
NANYA TECHNOLOGY CORPORATION HWA YA Technology Park 669, FU HSING 3rd Rd., Kueishan, Taoyuan, Taiwan, R.O.C. The NANYA TECHNOLOGY CORPORATION home page can be found at: http:\\www.nanya.com
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(c) NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
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